The K1050X plasma reactor is designed to meet the requirements of research and development and small-scale production for a wide and varied range of plasma etching, ashing and cleaning applications. Built to withstand heavy use (24 hours a day for some ashing schedules) the K1050X features microprocessor control with automatic operation and offers durability and simplicity of operation. Barrel systems plasma etch or plasma ash isotropically (in all directions) and are suitable for the majority of applications.
The K1050X is fitted with a solid state RF power supply (0-100W) and tuning circuits, dual process gas flow meters featuring full or restricted vent control. The chamber is cylindrical with a drawer system for ease of sample loading. The K1050X requires a separate rotary vacuum pump or optional turbo pump backed by a diaphragm pump.
The chamber drawer can be exchanged for a vacuum loading port for special cleaning applications in SEM/TEM. This usually employs an oxygen/argon mix of gases, the oxygen removing the organic material (hydrocarbons) and the argon giving a surface etching of the sample.